2004 | ||
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1 | EE | Guo Lihui, Zhang Yibin, Su Yong Jie Jeffrey: Integrating thick copper/Black DiamondTM layer in CMOS interconnect process for RF passive components. Microelectronics Reliability 44(4): 581-585 (2004) |
1 | Su Yong Jie Jeffrey | [1] |
2 | Guo Lihui | [1] |