Tomohiro Iguchi
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2004
1
EE
Taizo Tomioka
, Tomohiro Iguchi,
Ikuo Mori
: Thermosonic flip-chip bonding for SAW filter.
Microelectronics Reliability 44
(1): 149-154 (2004)
Coauthor
Index
1
Ikuo Mori
[
1
]
2
Taizo Tomioka
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
