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| 2004 | ||
|---|---|---|
| 1 | EE | Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott, Dongji Xie: Materials characterization of the effect of mechanical bending on area array package interconnects. Microelectronics Reliability 44(2): 275-285 (2004) |
| 1 | N. Todd Castello | [1] |
| 2 | Mike Cibulsky | [1] |
| 3 | Daniel T. Rooney | [1] |
| 4 | Dongji Xie | [1] |