| |
| 2005 | ||
|---|---|---|
| 2 | EE | Daniel T. Rooney, DeePak Nager, David Geiger, Dongkai Shanguan: Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds. Microelectronics Reliability 45(2): 379-390 (2005) |
| 2004 | ||
| 1 | EE | Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott, Dongji Xie: Materials characterization of the effect of mechanical bending on area array package interconnects. Microelectronics Reliability 44(2): 275-285 (2004) |
| 1 | Doug Abbott | [1] |
| 2 | N. Todd Castello | [1] |
| 3 | Mike Cibulsky | [1] |
| 4 | David Geiger | [2] |
| 5 | DeePak Nager | [2] |
| 6 | Dongkai Shanguan | [2] |
| 7 | Dongji Xie | [1] |