C. K. So

2004
1	EE	C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So: Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. Microelectronics Reliability 44(5): 823-831 (2004)

Coauthor Index

1	H. P. Chan	[1]
2	Y. C. Chan	[1]
3	N. W. Leung	[1]
4	C. W. Tan	[1]