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| 2004 | ||
|---|---|---|
| 1 | EE | Jason Y. L. Goh, Mark C. Pitter, Chung W. See, Michael G. Somekh, Daniel Vanderstraeten: Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages. Microelectronics Reliability 44(2): 259-267 (2004) |
| 1 | Jason Y. L. Goh | [1] |
| 2 | Mark C. Pitter | [1] |
| 3 | Chung W. See | [1] |
| 4 | Michael G. Somekh | [1] |