M. A. Uddin

2004
1	EE	M. A. Uddin, M. O. Alam, Y. C. Chan, H. P. Chan: Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film. Microelectronics Reliability 44(3): 505-514 (2004)

Coauthor Index

1	M. O. Alam	[1]
2	H. P. Chan	[1]
3	Y. C. Chan	[1]