| |
| 2004 | ||
|---|---|---|
| 1 | EE | Xiaowu Zhang, E. H. Wong, Charles Lee, Tai-Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath: Thermo-mechanical finite element analysis in a multichip build up substrate based package design. Microelectronics Reliability 44(4): 611-619 (2004) |
| 1 | Tai-Chong Chai | [1] |
| 2 | Charles Lee | [1] |
| 3 | D. Pinjala | [1] |
| 4 | Srinivasamurthy Sampath | [1] |
| 5 | Poi-Siong Teo | [1] |
| 6 | E. H. Wong | [1] |
| 7 | Xiaowu Zhang | [1] |