Xiang Dai
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2004
1
EE
Paul S. Ho
,
Guotao Wang
,
Min Ding
,
Jie-Hua Zhao
, Xiang Dai: Reliability issues for flip-chip packages.
Microelectronics Reliability 44
(5): 719-737 (2004)
Coauthor
Index
1
Min Ding
[
1
]
2
Paul S. Ho
[
1
]
3
Guotao Wang
[
1
]
4
Jie-Hua Zhao
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
