J. M. Kim

2005
2	EE	K. S. Kim, K. W. Ryu, C. H. Yu, J. M. Kim: The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces. Microelectronics Reliability 45(3-4): 647-655 (2005)
2004
1	EE	J. M. Kim, Y. E. Shin, K. Fujimoto: Dynamic modeling for resin self-alignment mechanism. Microelectronics Reliability 44(6): 983-992 (2004)

Coauthor Index

1	K. Fujimoto	[1]
2	K. S. Kim	[2]
3	K. W. Ryu	[2]
4	Y. E. Shin	[1]
5	C. H. Yu	[2]

Colors in the list of coauthors