| |
| 2004 | ||
|---|---|---|
| 1 | EE | Jinlin Wang, H. K. Lim, H. S. Lew, Woon Theng Saw, Chew Hong Tan: A testing method for assessing solder joint reliability of FCBGA packages. Microelectronics Reliability 44(5): 833-840 (2004) |
| 1 | H. K. Lim | [1] |
| 2 | Woon Theng Saw | [1] |
| 3 | Chew Hong Tan | [1] |
| 4 | Jinlin Wang | [1] |