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| 2004 | ||
|---|---|---|
| 1 | EE | Y. P. Wu, M. O. Alam, Y. C. Chan, B. Y. Wu: Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. Microelectronics Reliability 44(2): 295-302 (2004) |
| 1 | M. O. Alam | [1] |
| 2 | Y. C. Chan | [1] |
| 3 | Y. P. Wu | [1] |