| |
| 2007 | ||
|---|---|---|
| 2 | EE | Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong: Dynamic responses and solder joint reliability under board level drop test. Microelectronics Reliability 47(2-3): 450-460 (2007) |
| 2004 | ||
| 1 | EE | Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong: Impact life prediction modeling of TFBGA packages under board level drop test. Microelectronics Reliability 44(7): 1131-1142 (2004) |
| 1 | Jing-en Luan | [2] |
| 2 | Hun Shen Ng | [1] |
| 3 | Eric Pek | [1] [2] |
| 4 | Tong Yan Tee | [1] [2] |
| 5 | Zhaowei Zhong | [1] [2] |