| |
| 2004 | ||
|---|---|---|
| 1 | EE | Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl: Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. Microelectronics Reliability 44(5): 797-803 (2004) |
| 1 | Rolf Aschenbrenner | [1] |
| 2 | Dionysios Manessis | [1] |
| 3 | Andreas Ostmann | [1] |
| 4 | Herbert Reichl | [1] |