T. Lepistö
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2004
1
EE
S. Nurmi
,
J. Sundelin
,
Eero Ristolainen
, T. Lepistö: The effect of solder paste composition on the reliability of SnAgCu joints.
Microelectronics Reliability 44
(3): 485-494 (2004)
Coauthor
Index
1
S. Nurmi
[
1
]
2
Eero Ristolainen
[
1
]
3
J. Sundelin
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
