Xiaowu Zhang

2005
2	EE	Xiaowu Zhang, E. H. Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao: Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives. Microelectronics Reliability 45(7-8): 1215-1221 (2005)
2004
1	EE	Xiaowu Zhang, E. H. Wong, Charles Lee, Tai-Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath: Thermo-mechanical finite element analysis in a multichip build up substrate based package design. Microelectronics Reliability 44(4): 611-619 (2004)

Coauthor Index

1	J. F. J. M. Caers	[2]
2	Tai-Chong Chai	[1]
3	Mahadevan K. Iyer	[2]
4	Charles Lee	[1]
5	Yiyi Ma	[1]
6	D. Pinjala	[1]
7	Ranjan Rajoo	[2]
8	Srinivasamurthy Sampath	[1]
9	Poi-Siong Teo	[1]
10	E. H. Wong	[1] [2]
11	X. J. Zhao	[2]