| |
| 2005 | ||
|---|---|---|
| 2 | EE | Y. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin: New encapsulation development for fine pitch IC devices. Microelectronics Reliability 45(7-8): 1222-1229 (2005) |
| 2004 | ||
| 1 | EE | T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma: The impact of moisture in mold compound preforms on the warpage of PBGA packages. Microelectronics Reliability 44(4): 603-609 (2004) |
| 1 | K. H. Chua | [1] [2] |
| 2 | D. Crouthamel | [1] |
| 3 | T. Y. Lin | [1] [2] |
| 4 | Y. Y. Ma | [1] |
| 5 | S. Y. Teo | [1] |
| 6 | Y. F. Yao | [2] |