Jerry White
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2004
1
EE
Beth Keser
,
Li Wetz
, Jerry White: WL-CSP reliability with various solder alloys and die thicknesses.
Microelectronics Reliability 44
(3): 521-531 (2004)
Coauthor
Index
1
Beth Keser
[
1
]
2
Li Wetz
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
