| |
| 2004 | ||
|---|---|---|
| 1 | EE | T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma: The impact of moisture in mold compound preforms on the warpage of PBGA packages. Microelectronics Reliability 44(4): 603-609 (2004) |
| 1 | K. H. Chua | [1] |
| 2 | T. Y. Lin | [1] |
| 3 | Y. Y. Ma | [1] |
| 4 | B. Njoman | [1] |
| 5 | S. Y. Teo | [1] |