Ming-Chuen Yip

List of publications from the DBLP Bibliography Server - FAQ

2004

1 EE Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang: Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application. Microelectronics Reliability 44(4): 627-638 (2004)

2004
1	EE	Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang: Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application. Microelectronics Reliability 44(4): 627-638 (2004)

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