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2004 | ||
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1 | EE | Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl: Long time reliability study of soldered flip chips on flexible substrates. Microelectronics Reliability 44(2): 309-314 (2004) |
1 | Rolf Aschenbrenner | [1] |
2 | Christine Kallmayer | [1] |
3 | Herbert Reichl | [1] |