| |
| 2004 | ||
|---|---|---|
| 1 | EE | C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So: Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. Microelectronics Reliability 44(5): 823-831 (2004) |
| 1 | H. P. Chan | [1] |
| 2 | Y. C. Chan | [1] |
| 3 | C. K. So | [1] |
| 4 | C. W. Tan | [1] |