| |
| 2004 | ||
|---|---|---|
| 1 | EE | Jong-heon Kim, In-Soo Kang, Chi-jung Song, Young-Jik Hur, Hak-Nam Kim, Esdy Baek, Tae-Jun Seo: Flip-chip packaging solution for CMOS image sensor device. Microelectronics Reliability 44(1): 155-161 (2004) |
| 1 | Esdy Baek | [1] |
| 2 | Young-Jik Hur | [1] |
| 3 | In-Soo Kang | [1] |
| 4 | Hak-Nam Kim | [1] |
| 5 | Jong-heon Kim | [1] |
| 6 | Tae-Jun Seo | [1] |