Volume 47,
Number 1,
January 2007
Introductory Invited Papers
- Hei Wong, V. Filip, C. K. Wong, P. S. Chung:
Silicon integrated photonics begins to revolutionize.
1-10
Electronic Edition (link) BibTeX
- Viktor Sverdlov, Hans Kosina, Siegfried Selberherr:
Modeling current transport in ultra-scaled field-effect transistors.
11-19
Electronic Edition (link) BibTeX
- T. Hattori, H. Nohira, S. Shinagawa, M. Hori, M. Kase, T. Maruizumi:
Angle-resolved photoelectron spectroscopy on gate insulators.
20-26
Electronic Edition (link) BibTeX
- Ming-Dou Ker, Wei-Jen Chang:
Overview on ESD protection design for mixed-voltage I/O interfaces with high-voltage-tolerant power-rail ESD clamp circuits in low-voltage thin-oxide CMOS technology.
27-35
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Research Papers
- Sergey Shaimeev, Vladimir Gritsenko, Kaupo Kukli, Hei Wong, Eun-Hong Lee, Chungwoo Kim:
Single band electronic conduction in hafnium oxide prepared by atomic layer deposition.
36-40
Electronic Edition (link) BibTeX
- C. Leyris, F. Martinez, A. Hoffmann, M. Valenza, J. C. Vildeuil:
N-MOSFET oxide trap characterization induced by nitridation process using RTS noise analysis.
41-45
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- Y. Fu, H. Wong, J. J. Liou:
Characterization and modeling of flicker noise in junction field-effect transistor with source and drain trench isolation.
46-50
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- Milan Jevtic, Jovan M. Hadzi-Vukovic:
Study of the electrical cycling stressed large area Schottky diodes using I-V and noise measurements.
51-58
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- M. A. Belaïd, K. Ketata, M. Gares, K. Mourgues, M. Masmoudi, J. Marcon:
Comparative analysis of RF LDMOS capacitance reliability under accelerated ageing tests.
59-64
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- Giovanna Sozzi, Roberto Menozzi:
A review of the use of electro-thermal simulations for the analysis of heterostructure FETs.
65-73
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- Hirotaka Komoda, Chie Moritani, Kazutaka Takahashi, Heiji Watanabe, Kiyoshi Yasutake:
Sample tilting technique for preventing electrostatic discharge during high-current FIB gas-assisted etching with XeF2.
74-81
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- Hongfei Liu, Alin Hou, Hongbo Zhang, Daming Zhang, Maobin Yi:
A voltage calibration technique of electro-optic probing for characterization internal to IC's chip.
82-87
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- Yuki Fukuda, Michael D. Osterman, Michael G. Pecht:
The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth.
88-92
Electronic Edition (link) BibTeX
- J. Varghese, A. Dasgupta:
Test methodology for durability estimation of surface mount interconnects under drop testing conditions.
93-103
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- Yi-Shao Lai, Tong Hong Wang:
Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages.
104-110
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- Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen:
Cyclic bending reliability of wafer-level chip-scale packages.
111-117
Electronic Edition (link) BibTeX
- J. G. Lee, K. N. Subramanian:
Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn-Ag based solder joints.
118-131
Electronic Edition (link) BibTeX
- Stoyan Stoyanov, Robert W. Kay, Chris Bailey, Marc P. Y. Desmulliez:
Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives.
132-141
Electronic Edition (link) BibTeX
Volume 47,
Numbers 2-3,
February-March 2007
EuroSimE Special Section
- Artur Wymyslowski, Bart Vandevelde, Dag Andersson:
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.
159-160
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- F. Cacho, S. Orain, G. Cailletaud, H. Jaouen:
A constitutive single crystal model for the silicon mechanical behavior: Applications to the stress induced by silicided lines and STI in MOS technologies.
161-167
Electronic Edition (link) BibTeX
- Stephan Schoenfelder, Matthias Ebert, Christof Landesberger, Karlheinz Bock, Jörg Bagdahn:
Investigations of the influence of dicing techniques on the strength properties of thin silicon.
168-178
Electronic Edition (link) BibTeX
- M. A. J. van Gils, O. van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken:
Analysis of Cu/low-k bond pad delamination by using a novel failure index.
179-186
Electronic Edition (link) BibTeX
- Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Berhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel:
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept.
187-195
Electronic Edition (link) BibTeX
- Chang-Chun Lee, Chien-Chen Lee, Hsiao-Tung Ku, Shu-Ming Chang, Kuo-Ning Chiang:
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology.
196-204
Electronic Edition (link) BibTeX
- W. D. van Driel, A. Mavinkurve, M. A. J. van Gils, G. Q. Zhang:
Advanced structural similarity rules for the BGA package family.
205-214
Electronic Edition (link) BibTeX
- Nele Van Steenberge, Paresh Limaye, Geert Willems, Bart Vandevelde, Inge Schildermans:
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly.
215-222
Electronic Edition (link) BibTeX
- Steffen Wiese, Klaus-Jürgen Wolter:
Creep of thermally aged SnAgCu-solder joints.
223-232
Electronic Edition (link) BibTeX
- D. G. Yang, K. M. B. Jansen, L. J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen:
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.
233-239
Electronic Edition (link) BibTeX
- C. van't Hof, K. M. B. Jansen, G. Wisse, L. J. Ernst, D. G. Yang, G. Q. Zhang, H. J. L. Bressers:
Novel shear tools for viscoelastic characterization of packaging polymers.
240-247
Electronic Edition (link) BibTeX
- V. Gonda, K. M. B. Jansen, L. J. Ernst, J. den Toonder, G. Q. Zhang:
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques.
248-251
Electronic Edition (link) BibTeX
- M. Spraul, W. Nüchter, A. Möller, B. Wunderle, B. Michel:
Reliability of SnPb and Pb-free flip-chips under different test conditions.
252-258
Electronic Edition (link) BibTeX
- Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne:
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages.
259-265
Electronic Edition (link) BibTeX
- C. Andersson, D. R. Andersson, P. E. Tegehall, Johan Liu:
Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints.
266-272
Electronic Edition (link) BibTeX
- M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, R. B. R. van Silfhout, X. J. Fan, J. H. J. Janssen:
Virtual qualification of moisture induced failures of advanced packages.
273-279
Electronic Edition (link) BibTeX
- A. Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang:
Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability.
280-289
Electronic Edition (link) BibTeX
- H. J. L. Bressers, W. D. van Driel, K. M. B. Jansen, L. J. Ernst, G. Q. Zhang:
Correlation between chemistry of polymer building blocks and microelectronics reliability.
290-294
Electronic Edition (link) BibTeX
- S. Orain, J.-C. Barbé, X. Federspiel, P. Legallo, H. Jaouen:
FEM-based method to determine mechanical stress evolution during process flow in microelectronics, application to stress-voiding.
295-301
Electronic Edition (link) BibTeX
- Mats Lindgren, Ilja Belov, Magnus Törnvall, Peter Leisner:
Application of simulation-based decision making in product development of an RF module.
302-309
Electronic Edition (link) BibTeX
- D. G. Yang, K. M. B. Jansen, L. J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen:
Numerical modeling of warpage induced in QFN array molding process.
310-318
Electronic Edition (link) BibTeX
- Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont:
Dynamic void formation in a DD-copper-structure with different metallization geometry.
319-325
Electronic Edition (link) BibTeX
Polytronic 2005 Special Section
- Andrzej Dziedzic, Jan Felba:
Polytronic 2005.
327
Electronic Edition (link) BibTeX
- James E. Morris:
Isotropic conductive adhesives: Future trends, possibilities and risks.
328-330
Electronic Edition (link) BibTeX
- Jana Kolbe, Andreas Arp, Francesco Calderone, Edouard Marc Meyer, Wilhelm Meyer, Helmut Schaefer, Manuela Stuve:
Inkjettable conductive adhesive for use in microelectronics and microsystems technology.
331-334
Electronic Edition (link) BibTeX
- Ryszard Kisiel, Jan Felba, Janusz Borecki, Andrzej Moscicki:
Problems of PCB microvias filling by conductive paste.
335-341
Electronic Edition (link) BibTeX
- Tomasz Falat, Artur Wymyslowski, Jana Kolbe:
Numerical approach to characterization of thermally conductive adhesives.
342-346
Electronic Edition (link) BibTeX
- Péter Gordon, Bálint Balogh, Bálint Sinkovics:
Thermal simulation of UV laser ablation of polyimide.
347-353
Electronic Edition (link) BibTeX
- Andrzej Dziedzic:
Carbon/polyesterimide thick-film resistive composites - Experimental characterization and theoretical analysis of physicochemical, electrical and stability properties.
354-362
Electronic Edition (link) BibTeX
- Marika P. Immonen, Mikko Karppinen, Jorma K. Kivilahti:
Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards.
363-371
Electronic Edition (link) BibTeX
- J. Tardy, M. Erouel, A. L. Deman, A. Gagnaire, V. Teodorescu, M. G. Blanchin, B. Canut, A. Barau, M. Zaharescu:
Organic thin film transistors with HfO2 high-k gate dielectric grown by anodic oxidation or deposited by sol-gel.
372-377
Electronic Edition (link) BibTeX
Introductory Invited Paper
Review Paper
Research Papers
- X. Zou, J. P. Xu, C. X. Li, P. T. Lai, W. B. Chen:
A threshold-voltage model of SiGe-channel pMOSFET without Si cap layer.
391-394
Electronic Edition (link) BibTeX
- W. W. (Bill) Abadeer:
Effect of stress voltages on voltage acceleration and lifetime projections for ultra-thin gate oxides.
395-400
Electronic Edition (link) BibTeX
- C. Petit, D. Zander:
Low voltage stress induced leakage current and time to breakdown in ultra-thin (1.2-2.3nm) oxides.
401-408
Electronic Edition (link) BibTeX
- Kazufumi Watanabe, Akinobu Teramoto, Rihito Kuroda, Shigetoshi Sugawa, Tadahiro Ohmi:
Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction.
409-418
Electronic Edition (link) BibTeX
- You-Lin Wu, Shi-Tin Lin, Tsung-Min Chang, Juin J. Liou:
Reliability study of ultrathin oxide films subject to irradiation-then-stress treatment using conductive atomic force microscopy.
419-421
Electronic Edition (link) BibTeX
- Z. Khatir, S. Lefebvre, F. Saint-Eve:
Experimental and numerical investigations on delayed short-circuit failure mode of single chip IGBT devices.
422-428
Electronic Edition (link) BibTeX
- W. S. Lau, P. W. Qian, Taejoon Han, Nathan P. Sandler, S. T. Che, S. E. Ang, C. H. Tung, T. T. Sheng:
Evidence that N2O is a stronger oxidizing agent than O2 for both Ta2O5 and bare Si below 1000degreeC and temperature for minimum low-K interfacial oxide for high-K dielectric on Si.
429-433
Electronic Edition (link) BibTeX
- Jianyin Zhao, Fang Liu:
Reliability assessment of the metallized film capacitors from degradation data.
434-436
Electronic Edition (link) BibTeX
- B. Vermeersch, Gilbert De Mey:
Influence of substrate thickness on thermal impedance of microelectronic structures.
437-443
Electronic Edition (link) BibTeX
- J. W. C. de Vries, M. Y. Jansen, W. D. van Driel:
On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections.
444-449
Electronic Edition (link) BibTeX
- Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong:
Dynamic responses and solder joint reliability under board level drop test.
450-460
Electronic Edition (link) BibTeX
- Hamid R. Zarandi, Seyed Ghassem Miremadi:
Dependability evaluation of Altera FPGA-based embedded systems subjected to SEUs.
461-470
Electronic Edition (link) BibTeX
- Maria Teresa Sanz, Santiago Celma, Belén Calvo:
Low-distortion 4th order programmable Butterworth filter.
471-476
Electronic Edition (link) BibTeX
Copyright © Sun May 17 00:14:16 2009
by Michael Ley (ley@uni-trier.de)
