| |
| 2007 | ||
|---|---|---|
| 3 | EE | Yi-Shao Lai, Tong Hong Wang: Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages. Microelectronics Reliability 47(1): 104-110 (2007) |
| 2 | EE | Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen: Cyclic bending reliability of wafer-level chip-scale packages. Microelectronics Reliability 47(1): 111-117 (2007) |
| 2005 | ||
| 1 | EE | Yi-Shao Lai, Tong Hong Wang: Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly. Microelectronics Reliability 45(3-4): 575-582 (2005) |
| 1 | Ming-Hwa R. Jen | [2] |
| 2 | Yi-Shao Lai | [1] [2] [3] |
| 3 | Han-Hui Tsai | [2] |