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J. W. C. de Vries

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2007
1EEJ. W. C. de Vries, M. Y. Jansen, W. D. van Driel: On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections. Microelectronics Reliability 47(2-3): 444-449 (2007)

Coauthor Index

1W. D. van Driel [1]
2M. Y. Jansen [1]

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