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2007 | ||
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1 | EE | J. W. C. de Vries, M. Y. Jansen, W. D. van Driel: On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections. Microelectronics Reliability 47(2-3): 444-449 (2007) |
1 | W. D. van Driel | [1] |
2 | M. Y. Jansen | [1] |