K. N. Subramanian

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2007

1 EE J. G. Lee, K. N. Subramanian: Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn-Ag based solder joints. Microelectronics Reliability 47(1): 118-131 (2007)

2007
1	EE	J. G. Lee, K. N. Subramanian: Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn-Ag based solder joints. Microelectronics Reliability 47(1): 118-131 (2007)

Coauthor Index

1 J. G. Lee [1]