| |
| 2007 | ||
|---|---|---|
| 2 | EE | Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Berhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel: Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. Microelectronics Reliability 47(2-3): 187-195 (2007) |
| 1 | EE | Steffen Wiese, Klaus-Jürgen Wolter: Creep of thermally aged SnAgCu-solder joints. Microelectronics Reliability 47(2-3): 223-232 (2007) |
| 1 | Bjoern Boehme | [2] |
| 2 | Rainer Dudek | [2] |
| 3 | Bernd Michel | [2] |
| 4 | Mike Roellig | [2] |
| 5 | Klaus-Jürgen Wolter | [1] [2] |
| 6 | Berhard Wunderle | [2] |