| |
| 2007 | ||
|---|---|---|
| 1 | EE | Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Berhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel: Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. Microelectronics Reliability 47(2-3): 187-195 (2007) |
| 1 | Bjoern Boehme | [1] |
| 2 | Bernd Michel | [1] |
| 3 | Mike Roellig | [1] |
| 4 | Steffen Wiese | [1] |
| 5 | Klaus-Jürgen Wolter | [1] |
| 6 | Berhard Wunderle | [1] |