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2007 | ||
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1 | EE | Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Berhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel: Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. Microelectronics Reliability 47(2-3): 187-195 (2007) |
1 | Bjoern Boehme | [1] |
2 | Bernd Michel | [1] |
3 | Mike Roellig | [1] |
4 | Steffen Wiese | [1] |
5 | Klaus-Jürgen Wolter | [1] |
6 | Berhard Wunderle | [1] |