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| 2007 | ||
|---|---|---|
| 1 | EE | Yuki Fukuda, Michael D. Osterman, Michael G. Pecht: The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth. Microelectronics Reliability 47(1): 88-92 (2007) |
| 1 | Michael D. Osterman | [1] |
| 2 | Michael G. Pecht | [1] |