| 2007 |
|---|
| 5 | EE | D. G. Yang,
K. M. B. Jansen,
L. J. Ernst,
G. Q. Zhang,
H. J. L. Bressers,
J. H. J. Janssen:
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.
Microelectronics Reliability 47(2-3): 233-239 (2007) |
| 4 | EE | C. van't Hof,
K. M. B. Jansen,
G. Wisse,
L. J. Ernst,
D. G. Yang,
G. Q. Zhang,
H. J. L. Bressers:
Novel shear tools for viscoelastic characterization of packaging polymers.
Microelectronics Reliability 47(2-3): 240-247 (2007) |
| 3 | EE | M. A. J. van Gils,
W. D. van Driel,
G. Q. Zhang,
H. J. L. Bressers,
R. B. R. van Silfhout,
X. J. Fan,
J. H. J. Janssen:
Virtual qualification of moisture induced failures of advanced packages.
Microelectronics Reliability 47(2-3): 273-279 (2007) |
| 2 | EE | H. J. L. Bressers,
W. D. van Driel,
K. M. B. Jansen,
L. J. Ernst,
G. Q. Zhang:
Correlation between chemistry of polymer building blocks and microelectronics reliability.
Microelectronics Reliability 47(2-3): 290-294 (2007) |
| 1 | EE | D. G. Yang,
K. M. B. Jansen,
L. J. Ernst,
G. Q. Zhang,
W. D. van Driel,
H. J. L. Bressers,
J. H. J. Janssen:
Numerical modeling of warpage induced in QFN array molding process.
Microelectronics Reliability 47(2-3): 310-318 (2007) |
