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Ming-Hwa R. Jen

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2007
1EEYi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen: Cyclic bending reliability of wafer-level chip-scale packages. Microelectronics Reliability 47(1): 111-117 (2007)

Coauthor Index

1Yi-Shao Lai [1]
2Han-Hui Tsai [1]
3Tong Hong Wang [1]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)