| |
| 2007 | ||
|---|---|---|
| 2 | EE | Nele Van Steenberge, Paresh Limaye, Geert Willems, Bart Vandevelde, Inge Schildermans: Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly. Microelectronics Reliability 47(2-3): 215-222 (2007) |
| 1 | EE | Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne: Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. Microelectronics Reliability 47(2-3): 259-265 (2007) |
| 1 | Eric Beyne | [1] |
| 2 | Mario Gonzalez | [1] |
| 3 | Petar Ratchev | [1] |
| 4 | Inge Schildermans | [2] |
| 5 | Nele Van Steenberge | [2] |
| 6 | Bart Vandevelde | [1] [2] |
| 7 | Geert Willems | [2] |