| |
| 2007 | ||
|---|---|---|
| 2 | EE | Ryszard Kisiel, Jan Felba, Janusz Borecki, Andrzej Moscicki: Problems of PCB microvias filling by conductive paste. Microelectronics Reliability 47(2-3): 335-341 (2007) |
| 2005 | ||
| 1 | EE | Ryszard Kisiel, Janusz Borecki, Grazyna Koziol, Jan Felba: Conductive adhesives for through holes and blind vias metallization. Microelectronics Reliability 45(12): 1935-1940 (2005) |
| 1 | Jan Felba | [1] [2] |
| 2 | Ryszard Kisiel | [1] [2] |
| 3 | Grazyna Koziol | [1] |
| 4 | Andrzej Moscicki | [2] |