| |
| 2007 | ||
|---|---|---|
| 1 | EE | Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong: Dynamic responses and solder joint reliability under board level drop test. Microelectronics Reliability 47(2-3): 450-460 (2007) |
| 1 | Chwee Teck Lim | [1] |
| 2 | Eric Pek | [1] |
| 3 | Tong Yan Tee | [1] |
| 4 | Zhaowei Zhong | [1] |