2007 | ||
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1 | EE | Kazufumi Watanabe, Akinobu Teramoto, Rihito Kuroda, Shigetoshi Sugawa, Tadahiro Ohmi: Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction. Microelectronics Reliability 47(2-3): 409-418 (2007) |
1 | Rihito Kuroda | [1] |
2 | Tadahiro Ohmi | [1] |
3 | Shigetoshi Sugawa | [1] |
4 | Kazufumi Watanabe | [1] |