| 2007 |
|---|
| 4 | EE | M. A. J. van Gils,
O. van der Sluis,
G. Q. Zhang,
J. H. J. Janssen,
R. M. J. Voncken:
Analysis of Cu/low-k bond pad delamination by using a novel failure index.
Microelectronics Reliability 47(2-3): 179-186 (2007) |
| 3 | EE | W. D. van Driel,
A. Mavinkurve,
M. A. J. van Gils,
G. Q. Zhang:
Advanced structural similarity rules for the BGA package family.
Microelectronics Reliability 47(2-3): 205-214 (2007) |
| 2 | EE | M. A. J. van Gils,
W. D. van Driel,
G. Q. Zhang,
H. J. L. Bressers,
R. B. R. van Silfhout,
X. J. Fan,
J. H. J. Janssen:
Virtual qualification of moisture induced failures of advanced packages.
Microelectronics Reliability 47(2-3): 273-279 (2007) |
| 2005 |
|---|
| 1 | EE | W. D. van Driel,
M. A. J. van Gils,
R. B. R. van Silfhout,
G. Q. Zhang:
Prediction of Delamination Related IC & Packaging Reliability Problems.
Microelectronics Reliability 45(9-11): 1633-1638 (2005) |
