Han-Hui Tsai
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2007
1
EE
Yi-Shao Lai
,
Tong Hong Wang
, Han-Hui Tsai,
Ming-Hwa R. Jen
: Cyclic bending reliability of wafer-level chip-scale packages.
Microelectronics Reliability 47
(1): 111-117 (2007)
Coauthor
Index
1
Ming-Hwa R. Jen
[
1
]
2
Yi-Shao Lai
[
1
]
3
Tong Hong Wang
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
