| |
| 2007 | ||
|---|---|---|
| 1 | EE | Stoyan Stoyanov, Robert W. Kay, Chris Bailey, Marc P. Y. Desmulliez: Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives. Microelectronics Reliability 47(1): 132-141 (2007) |
| 1 | Chris Bailey (Christopher Bailey) | [1] |
| 2 | Marc P. Y. Desmulliez | [1] |
| 3 | Robert W. Kay | [1] |