| |
| 2007 | ||
|---|---|---|
| 1 | EE | C. Andersson, D. R. Andersson, P. E. Tegehall, Johan Liu: Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints. Microelectronics Reliability 47(2-3): 266-272 (2007) |
| 1 | D. R. Andersson | [1] |
| 2 | Johan Liu | [1] |
| 3 | P. E. Tegehall | [1] |