| |
| 2007 | ||
|---|---|---|
| 2 | EE | Artur Wymyslowski, Bart Vandevelde, Dag Andersson: Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectronics Reliability 47(2-3): 159-160 (2007) |
| 1 | EE | Tomasz Falat, Artur Wymyslowski, Jana Kolbe: Numerical approach to characterization of thermally conductive adhesives. Microelectronics Reliability 47(2-3): 342-346 (2007) |
| 1 | Dag Andersson | [2] |
| 2 | Tomasz Falat | [1] |
| 3 | Jana Kolbe | [1] |
| 4 | Bart Vandevelde | [2] |