![]() | ![]() |
2007 | ||
---|---|---|
4 | EE | J. G. Lee, K. N. Subramanian: Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn-Ag based solder joints. Microelectronics Reliability 47(1): 118-131 (2007) |
2000 | ||
3 | J. G. Lee, C. G. Chung: An optimal representative set selection method. Information & Software Technology 42(1): 17-25 (2000) | |
1997 | ||
2 | J. G. Lee, E. S. Lee: VEMA: Multi-Agent System for Electronic Commerce on Internet. HCI (1) 1997: 19-22 | |
1 | EE | J. G. Lee, J. Y. Kang, Eun-Seok Lee: ICOMA: An Open Infrastructure for Agent-based Intelligent Electronic Commerce on the Internet. ICPADS 1997: 648-655 |
1 | C. G. Chung | [3] |
2 | J. Y. Kang | [1] |
3 | E. S. Lee | [2] |
4 | Eun-Seok Lee | [1] |
5 | K. N. Subramanian | [4] |