| |
| 2007 | ||
|---|---|---|
| 1 | EE | Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne: Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. Microelectronics Reliability 47(2-3): 259-265 (2007) |
| 1 | Eric Beyne | [1] |
| 2 | Paresh Limaye | [1] |
| 3 | Petar Ratchev | [1] |
| 4 | Bart Vandevelde | [1] |