Volume 22,
Number 1,
January-February 2005
EIC Message
Features
Special Section:
Perspectives on Outsourcing
Panel Summaries
Features
- Tiehan Lv, Jiang Xu, Wayne Wolf, Burak Ozer, Jörg Henkel, Srimat T. Chakradhar:
A Methodology for Architectural Design of Multimedia Multiprocessor SoCs.
18-26
Electronic Edition (link) BibTeX
- Alberto La Rosa, Luciano Lavagno, Claudio Passerone:
Software Development for High-Performance, Reconfigurable, Embedded Multimedia Systems.
28-38
Electronic Edition (link) BibTeX
- Brian Delaney, Tajana Simunic, Nikil Jayant:
Energy-Aware Distributed Speech Recognition for Wireless Mobile Devices.
39-49
Electronic Edition (link) BibTeX
Special Features
Standards
Book Reviews
Departments
The Last Byte
Volume 22,
Number 2,
March-April 2005
From the EIC
Features
Special Features
Standards
Book Reviews
Panel Summaries
Newsletter
The Last Byte
Volume 22,
Number 3,
May-June 2005
From the EIC
DAC Watch
The New Face of Design for Manufacturability
- Juan Antonio Carballo, Yervant Zorian, Raul Camposano, Andrzej J. Strojwas, John Kibarian, Dennis Wassung, Alex Alexanian, Steve Wigley, Neil Kelly:
Guest Editors' Introduction: DFM Drives Changes in Design Flow.
200-205
Electronic Edition (link) BibTeX
- Alfred K. Wong:
Some Thoughts on the IC Design-Manufacture Interface.
206-213
Electronic Edition (link) BibTeX
- Jeng-Liang Tsai, Dong Hyun Baik, Charlie Chung-Ping Chen, Kewal K. Saluja:
Yield-Driven, False-Path-Aware Clock Skew Scheduling.
214-222
Electronic Edition (link) BibTeX
- Jay Jahangiri, David Abercrombie:
Value-Added Defect Testing Techniques.
224-231
Electronic Edition (link) BibTeX
- Greg Yeric, Ethan Cohen, John Garcia, Kurt Davis, Esam Salem, Gary Green:
Infrastructure for Successful BEOL Yield Ramp, Transfer to Manufacturing, and DFM Characterization at 65 nm and Below.
232-239
Electronic Edition (link) BibTeX
- Robert Madge:
New test paradigms for yield and manufacturability.
240-246
Electronic Edition (link) BibTeX
Special Features
Interview
- The Future Depends on Innovation: An Interview with Irwin M. Jacobs, cofounder, chairman, and CEO of Qualcomm.
268-279
Electronic Edition (link) BibTeX
Book Reviews
Conference Reports
Standards
DATC Newsletter
The Last Byte
Volume 22,
Number 4,
July-August 2005
From the EIC
Special Announcement
Features
- R. Iris Bahar, Mehdi Baradaran Tahoori, Sandeep K. Shukla, Fabrizio Lombardi:
Guest Editors' Introduction: Challenges for Reliable Design at the Nanoscale.
295-297
Electronic Edition (link) BibTeX
- Darshan D. Thaker, Francois Impens, Isaac L. Chuang, Rajeevan Amirtharajah, Frederic T. Chong:
Recursive TMR: Scaling Fault Tolerance in the Nanoscale Era.
298-305
Electronic Edition (link) BibTeX
- André DeHon, Helia Naeimi:
Seven Strategies for Tolerating Highly Defective Fabrication.
306-315
Electronic Edition (link) BibTeX
- Chen He, Margarida F. Jacome, Gustavo de Veciana:
A Reconfiguration-Based Defect-Tolerant Design Paradigm for Nanotechnologies.
316-326
Electronic Edition (link) BibTeX
- Jie Han, Jianbo Gao, Yan Qi, Pieter Jonker, José A. B. Fortes:
Toward Hardware-Redundant, Fault-Tolerant Logic for Nanoelectronics.
328-339
Electronic Edition (link) BibTeX
Special Features
Book Reviews
Panel Summaries
Conference Reports
DATC Newsletter
The Last Byte
Volume 22,
Number 5,
September-October 2005
From the EIC
DAC Report
Features
- André Ivanov, Giovanni De Micheli:
Guest Editors' Introduction: The Network-on-Chip Paradigm in Practice and Research.
399-403
Electronic Edition (link) BibTeX
- Partha Pratim Pande, Cristian Grecu, André Ivanov, Resve A. Saleh, Giovanni De Micheli:
Design, Synthesis, and Test of Networks on Chips.
404-413
Electronic Edition (link) BibTeX
- Kees Goossens, John Dielissen, Andrei Radulescu:
Æthereal Network on Chip: Concepts, Architectures, and Implementations.
414-421
Electronic Edition (link) BibTeX
- Se-Joong Lee, Kangmin Lee, Hoi-Jun Yoo:
Analysis and Implementation of Practical, Cost-Effective Networks on Chips.
422-433
Electronic Edition (link) BibTeX
- Srinivasan Murali, Theo Theocharides, Narayanan Vijaykrishnan, Mary Jane Irwin, Luca Benini, Giovanni De Micheli:
Analysis of Error Recovery Schemes for Networks on Chips.
434-442
Electronic Edition (link) BibTeX
- Christophe Bobda, Ali Ahmadinia:
Dynamic Interconnection of Reconfigurable Modules on Reconfigurable Devices.
443-451
Electronic Edition (link) BibTeX
Special Features
Interview
- Inventions: A Result of Risk-Taking, Diversity, and Holistic Thinking - An interview with Bernard S. Meyerson, IBM Fellow, Vice President, and Chief Technologist of IBM's System Technology Group.
472-477
Electronic Edition (link) BibTeX
Book Reviews
Conference Reports
Panel Summaries
Standards
DATC Newsletter
The Last Byte
Volume 22,
Number 6,
November-December 2005
From the EIC
Features
- Sachin S. Sapatnekar, Kevin J. Nowka:
Guest Editors' Introduction: New Dimensions in 3D Integration.
496-497
Electronic Edition (link) BibTeX
- W. Rhett Davis, John Wilson, Stephen Mick, Jian Xu, Hao Hua, Christopher Mineo, Ambarish M. Sule, Michael Steer, Paul D. Franzon:
Demystifying 3D ICs: The Pros and Cons of Going Vertical.
498-510
Electronic Edition (link) BibTeX
- Peter Benkart, Alexander Kaiser, Andreas Munding, Markus Bschorr, Hans-Jörg Pfleiderer, Erhard Kohn, Arne Heittmann, Holger Huebner, Ulrich Ramacher:
3D Chip Stack Technology Using Through-Chip Interconnects.
512-518
Electronic Edition (link) BibTeX
- Cristinel Ababei, Yan Feng, Brent Goplen, Hushrav Mogal, Tianpei Zhang, Kia Bazargan, Sachin S. Sapatnekar:
Placement and Routing in 3D Integrated Circuits.
520-531
Electronic Edition (link) BibTeX
- Sung Kyu Lim:
Physical Design for 3D System on Package.
532-539
Electronic Edition (link) BibTeX
- Philip Jacob, Okan Erdogan, Aamir Zia, Paul M. Belemjian, Russell P. Kraft, John F. McDonald:
Predicting the Performance of a 3D Processor-Memory Chip Stack.
540-547
Electronic Edition (link) BibTeX
- Annie (Yujuan) Zeng, James (JianQiang) Lü, Kenneth Rose, Ronald J. Gutmann:
First-Order Performance Prediction of Cache Memory with Wafer-Level3D Integration.
548-555
Electronic Edition (link) BibTeX
- Christianto C. Liu, Ilya Ganusov, Martin Burtscher, Sandip Tiwari:
Bridging the Processor-Memory Performance Gapwith 3D IC Technology.
556-564
Electronic Edition (link) BibTeX
Special ITC Section
Book Reviews
Panel Summaries
Conference Reports
TTTC Newsletter
The Last Byte
Copyright © Sat May 16 23:57:39 2009
by Michael Ley (ley@uni-trier.de)