| |
| 2005 | ||
|---|---|---|
| 1 | EE | Peter Benkart, Alexander Kaiser, Andreas Munding, Markus Bschorr, Hans-Jörg Pfleiderer, Erhard Kohn, Arne Heittmann, Holger Huebner, Ulrich Ramacher: 3D Chip Stack Technology Using Through-Chip Interconnects. IEEE Design & Test of Computers 22(6): 512-518 (2005) |
| 1 | Peter Benkart | [1] |
| 2 | Markus Bschorr | [1] |
| 3 | Arne Heittmann | [1] |
| 4 | Alexander Kaiser | [1] |
| 5 | Erhard Kohn | [1] |
| 6 | Andreas Munding | [1] |
| 7 | Hans-Jörg Pfleiderer | [1] |
| 8 | Ulrich Ramacher | [1] |