2007 |
3 | EE | Phil Jacobs,
Aamir Zia,
Okan Erdogan,
Paul M. Belemjian,
Peng Jin,
Jin Woo Kim,
Michael Chu,
Russell P. Kraft,
John F. McDonald:
Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking.
ICCD 2007: 202-207 |
2005 |
2 | EE | Philip Jacob,
Okan Erdogan,
Aamir Zia,
Paul M. Belemjian,
Russell P. Kraft,
John F. McDonald:
Predicting the Performance of a 3D Processor-Memory Chip Stack.
IEEE Design & Test of Computers 22(6): 540-547 (2005) |
2003 |
1 | EE | John Mayega,
Okan Erdogan,
Paul M. Belemjian,
Kuan Zhou,
John F. McDonald,
Russell P. Kraft:
3D direct vertical interconnect microprocessors test vehicle.
ACM Great Lakes Symposium on VLSI 2003: 141-146 |