| 2008 |
|---|
| 6 | EE | Paul D. Franzon,
W. Rhett Davis,
Michael Steer,
Steve Lipa,
Eun Chu Oh,
Thor Thorolfsson,
Samson Melamed,
Sonali Luniya,
Tad Doxsee,
Stephen Berkeley,
Ben Shani,
Kurt Obermiller:
Design and CAD for 3D integrated circuits.
DAC 2008: 668-673 |
| 2007 |
|---|
| 5 | EE | Ravi Jenkal,
W. Rhett Davis:
An architecture for energy efficient sphere decoding.
ISLPED 2007: 244-249 |
| 2006 |
|---|
| 4 | EE | Hao Hua,
Christopher Mineo,
Kory Schoenfliess,
Ambarish M. Sule,
Samson Melamed,
Ravi Jenkal,
W. Rhett Davis:
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits.
DAC 2006: 997-1002 |
| 2005 |
|---|
| 3 | EE | W. Rhett Davis,
John Wilson,
Stephen Mick,
Jian Xu,
Hao Hua,
Christopher Mineo,
Ambarish M. Sule,
Michael Steer,
Paul D. Franzon:
Demystifying 3D ICs: The Pros and Cons of Going Vertical.
IEEE Design & Test of Computers 22(6): 498-510 (2005) |
| 2004 |
|---|
| 2 | EE | W. Rhett Davis,
Ambarish M. Sule,
Hao Hua:
Multi-Parameter Power Minimization of Synthesized Datapaths.
ISVLSI 2004: 151-157 |
| 2003 |
|---|
| 1 | EE | W. Rhett Davis:
Getting High-Performance Silicon from System-Level Design.
ISVLSI 2003: 238-243 |
