2008 |
43 | EE | Chaitanya Kshirsagar,
Mohamed N. El-Zeftawi,
Kaustav Banerjee:
Analysis and implications of parasitic and screening effects on the high-frequency/RF performance of tunneling-carbon nanotube FETs.
DAC 2008: 250-255 |
42 | EE | Navin Srivastava,
Roberto Suaya,
Kaustav Banerjee:
High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting Substrate.
DATE 2008: 426-431 |
41 | EE | Hamed F. Dadgour,
Vivek De,
Kaustav Banerjee:
Statistical modeling of metal-gate work-function variability in emerging device technologies and implications for circuit design.
ICCAD 2008: 270-277 |
40 | EE | Sheng-Chih Lin,
Kaustav Banerjee:
A Design-Specific and Thermally-Aware Methodology for Trading-Off Power and Performance in Leakage-Dominant CMOS Technologies.
IEEE Trans. VLSI Syst. 16(11): 1488-1498 (2008) |
2007 |
39 | EE | Hamed F. Dadgour,
Kaustav Banerjee:
Design and Analysis of Hybrid NEMS-CMOS Circuits for Ultra Low-Power Applications.
DAC 2007: 306-311 |
38 | EE | Nikil Dutt,
Kaustav Banerjee,
Luca Benini,
Kanishka Lahiri,
Sudeep Pasricha:
Tutorial 5: SoC Communication Architectures: Technology, Current Practice, Research, and Trends.
VLSI Design 2007: 8 |
37 | EE | Shashidhar Mysore,
Banit Agrawal,
Navin Srivastava,
Sheng-Chih Lin,
Kaustav Banerjee,
Timothy Sherwood:
3D Integration for Introspection.
IEEE Micro 27(1): 77-83 (2007) |
2006 |
36 | EE | Kaustav Banerjee,
Sheng-Chih Lin,
Navin Srivastava:
Electrothermal engineering in the nanometer era: from devices and interconnects to circuits and systems.
ASP-DAC 2006: 223-230 |
35 | EE | Shashidhar Mysore,
Banit Agrawal,
Navin Srivastava,
Sheng-Chih Lin,
Kaustav Banerjee,
Timothy Sherwood:
Introspective 3D chips.
ASPLOS 2006: 264-273 |
34 | EE | Kaustav Banerjee,
Navin Srivastava:
Are carbon nanotubes the future of VLSI interconnections?
DAC 2006: 809-814 |
33 | EE | Hamed F. Dadgour,
Rajiv V. Joshi,
Kaustav Banerjee:
A novel variation-aware low-power keeper architecture for wide fan-in dynamic gates.
DAC 2006: 977-982 |
32 | EE | Gian Luca Loi,
Banit Agrawal,
Navin Srivastava,
Sheng-Chih Lin,
Timothy Sherwood,
Kaustav Banerjee:
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy.
DAC 2006: 991-996 |
31 | EE | Sheng-Chih Lin,
Kaustav Banerjee:
An electrothermally-aware full-chip substrate temperature gradient evaluation methodology for leakage dominant technologies with implications for power estimation and hot-spot management.
ICCAD 2006: 568-574 |
30 | EE | Rajiv V. Joshi,
Kaustav Banerjee,
André DeHon:
Tutorial 1: Emerging Technologies for VLSI Design.
ISQED 2006: 4 |
2005 |
29 | | Navin Srivastava,
Kaustav Banerjee:
Performance analysis of carbon nanotube interconnects for VLSI applications.
ICCAD 2005: 383-390 |
28 | EE | Sheng-Chih Lin,
Navin Srivastava,
Kaustav Banerjee:
A Thermally-Aware Methodology for Design-Specific Optimization of Supply and Threshold Voltages in Nanometer Scale ICs.
ICCD 2005: 411-416 |
27 | EE | Vineet Wason,
Kaustav Banerjee:
A probabilistic framework for power-optimal repeater insertion in global interconnects under parameter variations.
ISLPED 2005: 131-136 |
26 | EE | Navin Srivastava,
Xiaoning Qi,
Kaustav Banerjee:
Impact of On-chip Inductance on Power Distribution Network Design for Nanometer Scale Integrated Circuits.
ISQED 2005: 346-351 |
25 | EE | Lech Józwiak,
Kaustav Banerjee:
Plenary Session 2P.
ISQED 2005: 461 |
24 | EE | Amir H. Ajami,
Kaustav Banerjee,
Massoud Pedram:
Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects.
IEEE Trans. on CAD of Integrated Circuits and Systems 24(6): 849-861 (2005) |
23 | EE | Man Lung Mui,
Kaustav Banerjee,
Amit Mehrotra:
Supply and power optimization in leakage-dominant technologies.
IEEE Trans. on CAD of Integrated Circuits and Systems 24(9): 1362-1371 (2005) |
2004 |
22 | EE | Anirban Basu,
Sheng-Chih Lin,
Vineet Wason,
Amit Mehrotra,
Kaustav Banerjee:
Simultaneous optimization of supply and threshold voltages for low-power and high-performance circuits in the leakage dominant era.
DAC 2004: 884-887 |
21 | EE | Songqing Zhang,
Vineet Wason,
Kaustav Banerjee:
A probabilistic framework to estimate full-chips subthreshold leakage power distribution considering within-die and die-to-die P-T-V variations.
ISLPED 2004: 156-161 |
20 | EE | Anirban Basu,
Sheng-Chih Lin,
Christoph Wasshuber,
Adrian M. Ionescu,
Kaustav Banerjee:
A Comprehensive Analytical Capacitance Model of a Two Dimensional Nanodot Array.
ISQED 2004: 259-264 |
19 | EE | Man Lung Mui,
Kaustav Banerjee,
Amit Mehrotra:
Power Supply Optimization in sub-130 nm Leakage Dominant Technologies .
ISQED 2004: 409-414 |
18 | EE | Adil Koukab,
Kaustav Banerjee,
Michel J. Declercq:
Modeling techniques and verification methodologies for substrate coupling effects in mixed-signal system-on-chip designs.
IEEE Trans. on CAD of Integrated Circuits and Systems 23(6): 823-836 (2004) |
2003 |
17 | EE | Santanu Mahapatra,
Kaustav Banerjee,
Florent Pegeon,
Adrian M. Ionescu:
A CAD Framework for Co-Design and Analysis of CMOS-SET Hybrid Integrated Circuits.
ICCAD 2003: 497-503 |
2002 |
16 | EE | Adrian M. Ionescu,
Michel J. Declercq,
Santanu Mahapatra,
Kaustav Banerjee,
Jacques Gautier:
Few electron devices: towards hybrid CMOS-SET integrated circuits.
DAC 2002: 88-93 |
15 | EE | Adil Koukab,
Kaustav Banerjee,
Michel J. Declercq:
Analysis and optimization of substrate noise coupling in single-chip RF transceiver design.
ICCAD 2002: 309-316 |
14 | EE | Santanu Mahapatra,
Adrian M. Ionescu,
Kaustav Banerjee,
Michel J. Declercq:
A SET quantizer circuit aiming at digital communication system.
ISCAS (5) 2002: 860-863 |
13 | EE | Kaustav Banerjee,
Amit Mehrotra:
Inductance Aware Interconnect Scaling.
ISQED 2002: 43-47 |
12 | EE | Adrian M. Ionescu,
V. Pott,
R. Fritschi,
Kaustav Banerjee,
Michel J. Declercq,
P. Renaud,
C. Hibert,
Philippe Flückiger,
G. A. Racine:
Modeling and Design of a Low-Voltage SOI Suspended-Gate MOSFET (SG-MOSFET) with a Metal-over-Gate Architecture.
ISQED 2002: 496-501 |
11 | EE | Kaustav Banerjee,
Amit Mehrotra:
Analysis of on-chip inductance effects for distributed RLC interconnects.
IEEE Trans. on CAD of Integrated Circuits and Systems 21(8): 904-915 (2002) |
2001 |
10 | EE | Amir H. Ajami,
Kaustav Banerjee,
Massoud Pedram,
Lukas P. P. P. van Ginneken:
Analysis of Non-Uniform Temperature-Dependent Interconnect Performance in High Performance ICs.
DAC 2001: 567-572 |
9 | EE | Kaustav Banerjee,
Amit Mehrotra:
Analysis of On-Chip Inductance Effects using a Novel Performance Optimization Methodology for Distributed RLC Interconnects.
DAC 2001: 798-803 |
8 | EE | Kaustav Banerjee,
Amit Mehrotra:
Coupled Analysis of Electromigration Reliability and Performance in ULSI Signal Nets.
ICCAD 2001: 158-164 |
7 | EE | TingYen Chiang,
Kaustav Banerjee,
Krishna Saraswat:
Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects.
ICCAD 2001: 165- |
6 | EE | Amir H. Ajami,
Kaustav Banerjee,
Massoud Pedram:
Analysis of Substrate Thermal Gradient Effects on Optimal Buffer Insertion.
ICCAD 2001: 44-48 |
5 | EE | Kaustav Banerjee,
Massoud Pedram,
Amir H. Ajami:
Analysis and optimization of thermal issues in high-performance VLSI.
ISPD 2001: 230-237 |
4 | EE | Choshu Ito,
Kaustav Banerjee,
Robert W. Dutton:
Analysis and Design of ESD Protection Circuits for High-Frequency/RF Applications.
ISQED 2001: 117-122 |
2000 |
3 | EE | Shukri J. Souri,
Kaustav Banerjee,
Amit Mehrotra,
Krishna Saraswat:
Multiple Si layer ICs: motivation, performance analysis, and design implications.
DAC 2000: 213-220 |
2 | EE | Krishna Saraswat,
Shukri J. Souri,
Kaustav Banerjee,
Pawan Kapur:
Performance analysis and technology of 3-D ICs.
SLIP 2000: 85-90 |
1999 |
1 | EE | Kaustav Banerjee,
Amit Mehrotra,
Alberto L. Sangiovanni-Vincentelli,
Chenming Hu:
On Thermal Effects in Deep Sub-Micron VLSI Interconnects.
DAC 1999: 885-891 |