| 2008 |
| 9 | EE | Krishna Saraswat,
Hoyeol Cho,
Pawan Kapur,
Kyung-Hoae Koo:
Performance comparison between copper, carbon nanotube, and optical interconnects.
ISCAS 2008: 2781-2784 |
| 2007 |
| 8 | EE | Hoyeol Cho,
Kyung-Hoae Koo,
Pawan Kapur,
Krishna Saraswat:
Modeling of the performance of carbon nanotube bundle, cu/low-k and optical on-chip global interconnects.
SLIP 2007: 81-88 |
| 2004 |
| 7 | EE | Krishna Saraswat:
Performance Limitations of Devices and Interconnects and Possible Alternatives for Nanoelectronics.
ISQED 2004: 327 |
| 6 | EE | Bipin Rajendran,
Pawan Kapur,
Krishna Saraswat,
R. Fabian,
W. Pease:
Self-consistent power/performance/reliability analysis for copper interconnects.
SLIP 2004: 17-22 |
| 2002 |
| 5 | EE | Pawan Kapur,
Gaurav Chandra,
Krishna Saraswat:
Power estimation in global interconnects and its reduction using a novel repeater optimization methodology.
DAC 2002: 461-466 |
| 2001 |
| 4 | EE | TingYen Chiang,
Kaustav Banerjee,
Krishna Saraswat:
Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects.
ICCAD 2001: 165- |
| 2000 |
| 3 | EE | Shukri J. Souri,
Kaustav Banerjee,
Amit Mehrotra,
Krishna Saraswat:
Multiple Si layer ICs: motivation, performance analysis, and design implications.
DAC 2000: 213-220 |
| 2 | EE | Krishna Saraswat,
Shukri J. Souri,
Kaustav Banerjee,
Pawan Kapur:
Performance analysis and technology of 3-D ICs.
SLIP 2000: 85-90 |
| 1995 |
| 1 | EE | Shailesh Agarwal,
Arthur M. Keller,
Gio Wiederhold,
Krishna Saraswat:
Flexible Relation: An Approach for Integrating Data from Multiple, Possibly Inconsistent Databases.
ICDE 1995: 495-504 |