Performance comparison between copper, carbon nanotube, and optical interconnects.
ISCAS 2008: 2781-2784|
Modeling of the performance of carbon nanotube bundle, cu/low-k and optical on-chip global interconnects.
SLIP 2007: 81-88|
Self-consistent power/performance/reliability analysis for copper interconnects.
SLIP 2004: 17-22|
Power estimation in global interconnects and its reduction using a novel repeater optimization methodology.
DAC 2002: 461-466|
Shukri J. Souri,
Performance analysis and technology of 3-D ICs.
SLIP 2000: 85-90|